DAGE4600W 全自動焊接推拉力測試機(jī)

4600-W鍵合測試儀是一種臺式系統(tǒng)，設(shè)計(jì)用于自動執(zhí)行復(fù)雜的測試程序，無需操作員輸入。該系統(tǒng)可以自動完成具有不同鍵方向的剪切和拉伸測試模式，同時(shí)在完成后記錄故障模式圖像

Load large batches of samples and benefit from robotic handling to load, align and transfer each device to the Bondtester.

	Repeatable Results Every Time		Improve Tool ROI
Our linear encoder stages with 100nm resolution ensure you get to the right location every time.		Start the test then attend to other work while the system automatically completes large batch testing. Tests can be controlled and data exported using SECS/GEM protocols integrated with your factory.
	Data is Everything		Ultimate Product Safety
Achieve maximum data integrity with multiple on-board cameras to recognize fiducial markings and automatically capture failure mode images.		Using robotic handling with vacuum you can safely load and unload your product and protect from handling errors and damage. There is no risk of losing a batch and no need to ever repeat a test.
	Remove the Expert		Maximum UPH
Paragon™ software is easy to use and simple to set-up for a new product, meaning you don;t need to rely on expert operators as a single point of failure. A single operator can manage multiple systems if required.		Fully integrated cassette handling and mapping capabilities combined with device mapping delivers maximum efficiency. Achieve consistent UPH results 24/7 regardless of who is operating the Bondtester.

Applications:

Automatic testing for leadframe and wafers (<200mm)

Paragon™ – Your automation partner

• Automation assisted GUI

• Build in check list & help

• Multi window views

• Schematic virtual images displayed

Import maps or create your own

• Import wafer map file SINF / G85 / Klarf (AOI) / New Format

• Wire pull and ball shear pattern displays

• Colour gradients indicate different heights

• Inter-die wire corrections

Map interface display	Wire pull pattern	Ball shear pattern	Inter-die wire connections

Remove uncertainty - camera assisted programming

• Ultimate accuracy using on-board cameras

• Both high resolution and field of view cameras as standard

• Fiducial images for alignment

Automatic fiducial recognition	On board camera live images during testing	High resolution and FOV cameras

Image every failure mode – even with extreme height variations

• Compound Surface Imaging (CSI) scans through a Z-stack to get every point in focus

• Automatically return to the failure site to record an image

• Assists with failure mode analysis

• Comes as standard with every 4600 Bondtester

Compound surface imaging (CSI)		Standard image	DAGE CSI image